Capability Statement


  • Data acquisition rates up to 100 MB/s
  • Control loops up to 40 MHz
  • Field Programmable Gate Array (FPGA) system development up to 200 MHz
  • Software IP set for autonomous vehicle control systems
  • Windows based User Interface (core IP set)
  • Offline accessible global aerial map display
  • Mission critical software architecture (core IP set)
  • Machine vision image processing (core IP set)


  • Printed circuit design and manufacture up to 16 layers
  • Manage on circuit voltages up to 500V
  • Manage on circuit currents up to 400 A
  • On circuit frequencies from DC to 6 Ghz
  • Manufacture of application specific connectors
  • RoHS Compliant designs
  • Design for component size down to 0.25 mm pitch
  • Scalable production volumes from a single unit to automated mass production
  • Design for RS232, RS485, SPI, I2C, USB, Gigabit Ethernet, CAN, Modbus, EtherCAT


  • Manage design & production down to 0.01 mm accuracies
  • Scalable production volumes from a single unit to mass production
  • Design for material and production styles (Aluminum: 6063-T6, 7075-T6, Carbon Fiber Plate and Tube, Polycarbonate Forming, Nylon Machining, Closed Cell Foam Machining, Printing Processes: FDM, SLA, SLS)
  • Software based design of high part volume assemblies
  • Finite Element Analysis
  • Automated mechanical test systems
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